Housings for electronic devices

专利名称：Housings for electronic devices

发明人：Douglas Weber,Stephen P. Zadesky,Stephen

Brian Lynch

申请号：US16278022申请日：20190215公开号：US11077593B2公开日：20210803

专利附图：

摘要：Methods and apparatus for applying internal features or complex mechanicalstructures to a surface of a metal part are disclosed. According to one aspect of thepresent invention, a method for creating an assembly that includes a substrate and amolded piece involves obtaining the substrate, and forming at least one binding featureon a surface of the substrate. The method also includes molding on a surface of thebinding feature and the surface of the substrate. Molding on the surface of the bindingfeature and the surface of the substrate mechanically binds the molded piece to thesubstrate.

申请人：Apple Inc.

地址：Cupertino CA US

国籍：US

代理机构：Brownstein Hyatt Farber Schreck, LLP

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