搜索
您的当前位置:首页Conductive structure and method of manufacturing t

Conductive structure and method of manufacturing t

来源:智榕旅游
专利内容由知识产权出版社提供

专利名称:Conductive structure and method of

manufacturing the same

发明人:Kai Meng申请号:US13095726申请日:20110427公开号:US09006598B2公开日:20150414

专利附图:

摘要:The disclosure relates to a touch panel, a method for manufacturing the same,and a touch display device using the same. The touch panel includes a substrate, a lowerconductive layer disposed on the substrate, an insulating layer disposed on the lower

conductive layer, at least one first conductive wire disposed on the insulating layer, a lightshielding layer disposed on the first conductive wire, and an upper conductive layerdisposed on the light shielding layer. The light shielding layer and the at least one firstconductive wire are located in an edge region of the touch panel in a planar view. Thelight shielding layer includes at least one first through hole. The upper conductive layer iselectrically connected to the at least one first conductive wire via the at least one firstthrough hole.

申请人:Kai Meng

地址:Shenzhen CN

国籍:CN

代理机构:Li & Cai Intellectual Property (USA) Office

更多信息请下载全文后查看

因篇幅问题不能全部显示,请点此查看更多更全内容

Top