专利名称：Printed circuit board with embedded
decoupling capacitance and method forproducing same
发明人：Lauffer, John M.,Papathomas, Konstantinos申请号：EP97304050.4申请日：19970611公开号：EP0813355B1公开日：20020918
摘要：A method is provided for producing a capacitor to be embedded in anelectronic circuit package comprising the steps of selecting a first conductor foil,selecting a dielectric material, coating the dielectric material on at least one side of thefirst conductor foil, and layering the coated foil with a second conductor foil on top ofthe coating of dielectric material. Also claimed is an electronic circuit packageincorporating at least one embedded capacitor manufactured in accordance with thepresent invention.
申请人：IBM
地址：US
国籍：US
代理机构：Jennings, Michael John
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