PLATING METHOD AND PLATED METAL

专利名称：PLATING METHOD AND PLATED METAL发明人：Do Young Cheong,Jin Wook Choi,June Seok

Oh,Ri A Kim,Hae Sun Yon

申请号：US16623775申请日：20191023

公开号：US20210340675A1公开日：20211104

专利附图：

摘要：Provided is a plating method including performing a first masking that masks afirst region and a second region among the first region including only a first metal andthe second region including only a second metal in a clad metal having the first metal andthe second metal cladded, and a third region including a contact part between the firstmetal and the second metal, precipitating the clad metal in a first plating solution,performing a second masking that removes the processed masking in one of the firstregion and the second region, precipitating at least the region where the second maskinghas been performed in a second plating solution, and precipitating the region where thesecond masking has been performed and the third region in a third plating solution.

申请人：DAE SAN ELECTRONICS CO., LTD.

地址：Hwaseong-si KR

国籍：KR

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