专利名称：METHOD FOR PRODUCING A SUPPORT
ELEMENT FOR AN INTEGRATED CIRCUIT (IC)COMPONENT
发明人：SENGE, CARSTEN,STAUDT,
MATHIAS,MENTZER, RUEDIGER
申请号：EP00988572.4申请日：20001110公开号：EP1230679A2公开日：20020814
摘要：A process for the preparation of a support element for a provided forinstallation in a data carrier card ic - building block, in the case of an electrically
conductive layer are etched conductor tracks on both flat sides of the support elementhave in each case, contact surfaces, which on the one side of the respective terminalcontacts of the ic - building block, which are assigned and on the other side to theexternal contacting are provided, wherein the outer contact surfaces and the associatedconductor tracks with a further electrically conductive protective layer are
coated,characterized in that– in a first process step, the electrically conductive layer (1)on a flat side on the one for the contact surfaces are provided. 2a (2b) with a liquid orpasty, hardenable, etch-resistant protective material (2) is coated, wherein the coveringmaterial (2) can be removed easily,– then the remaining uncoated surface areas (3a, 3b, 3c)of the same flat side with a liquid or pasty, hardenable, etch-resistant, electrically non-conductive material (3) are coated,– in the next steps of the electrically conductive layer..
申请人：ORGA KARTENSYSTEME GMBH
地址：Am Hoppenhof 33 33104 Paderborn DE
国籍：DE
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